Surface grinding - WikipediaBibliography. Todd, Robert H.; Allen, Dell K.; Alting, Leo (1994), Manufacturing Processes Reference Guide, Industrial Press Inc., ISBN 0-8311-3049-0 .Bibliography - Springer LinkBibliography. 235. [KinWhe66] King, Alan G., and W.M. Wheildon, (1966), Ceramics in Machining. Processes, Academic Press, New York and London. [Kireta177]. Kirk, J. A., Cardenas-Garcia, J.F., and Allison, C.R., (1977), "Evaluation of Grinding Lubricants - Simulation Testing and Grinding Performance,". Wear, Vol.20.
ELID grinding of silicon wafers: a literature review - CiteSeerXliterature on ELID grinding, covering its set-ups, wheel dressing mechanism, and experimental results. It also discusses the technical barriers that have to be overcome before ELID grinding can be used in manufacturing. Keywords: Electrolytic in-process dressing; Grinding; Machining; Semiconductor material;. Silicon wafer.Grinding wheels for manufacturing of silicon wafers: A literature reviewThis paper published as: Liu, J.H., Pei, Z.J., and Fisher, G.R., 2007, “Grinding wheels for manufacturing of silicon wafers: a literature review,” International Journal of Machine Tools and. Manufacture, Vol. 47, No. 1, pp. 1–13. Abstract. Grinding is an important process for manufacturing of silicon wafers. The demand for silicon.
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